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Micro Chip Fuse

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

C

A

B

Preheating

Peak

Heating

Time

The following are precautions for individual products. Please also refer to the common precautions shown on page 4

of this catalog.

1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)

under normal conditions is within 70% of the rated current.

2. Do not continuously pass a current exceeding the rated current through the fuses.

3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take

care not to cause unwanted fusing. Calculate the I

of pulses according to the I

tolerance, consult our sales staff in advance.

4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure

that the abnormal current generated when a circuit abnormality occurs in your product is at least double or

greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not

exceed the maximum interrupting current of the fuses.

5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary

side.

6. Ensure that the voltage applied to the fuses are within their rated voltage.

7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses

on your products and carefully check and evaluate their category temperature range.

Safety Precautions

<Repair with hand soldering>

● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder

each electrode for 3 seconds or less.

● Never touch this product with the tip of a soldering iron.

Type

(inch size)

Dimensions (mm)

AB

C

ERBRD(0402)

0.5 to 0.6

1.4 to 1.6

0.4 to 0.6

ERBRE(0603)

0.7 to 0.9

2.0 to 2.2

0.8 to 1.0

ERBRG(1206)

2.0 to 2.4

4.4 to 5.0

1.2 to 1.8

Temperature

Time

Preheating

140 °C to 160 °C

60 s to 120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 5 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 180 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

For soldering

For lead-free soldering

Temperature

TimeTemperature

Time

Preheating

140 °C to 180 °C

60 s to 120 s

150 °C to 180 °C

60 s to 120 s

Soldering

245 ± 5 °C

20 s to 30 s

max. 260 °C

max. 10 s

Recommendations and precautions are described below.

● Recommended soldering conditions for reflow

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

● Recommended soldering conditions for flow

· Reflow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those specified.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

Sep. 2010

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