HI-8592, HI-8593, HI-8594

HOLT INTEGRATED CIRCUITS

8

PACKAGE THERMAL CHARACTERISTICS

Maximum ARINC LOAD

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

14-Lead Plastic

44

45

45

31

91

131

58

57

55

33

93

132

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

14-Lead Plastic

118

108

98

44

102

140

120

106

92

44

102

140

Maximum ARINC LOAD

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

8-Lead Plastic

26

27

28

42

103

144

34

35

35

50

111

151

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

8-Lead Plastic

64

62

60

79

137

176

68

66

64

83

141

179

Notes:

1.

All data taken in still air.

2.

At 100% duty cycle, 5V power supplies.

3.

Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.

4.

High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF as this is considered unrealistic for

high speed operation.

5.

14 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.

6.

Similar results would be obtained with TXAOUT shorted to TXBOUT.

7.

For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

8.

Data will vary depending on air flow and the method of heat sinking employed.