Notes:

1. All data taken in still air.

2. At 100% duty cycle, 5V power supplies.

3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms,C=30nF.

4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF

as this is considered unrealistic for high speed operation.

5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.

6. Similar results would be obtained with TXAOUT shorted to TXBOUT.

7. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

8. Data will vary depending on air flow and the method of heat sinking employed.

PACKAGE THERMAL CHARACTERISTICS

PACKAGE STYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj C

DATA RATE

1

2

°

°°

°

°

°

°

Ta=25 C

Ta=85 C

Ta=125 C

Ta=25 C

Ta=85 C

Ta=125 C

Low Speed

30.26

29.22

28.46

53.75

112.76

152.04

High Speed

30.44

29.42

28.68

53.92

112.95

152.25

3

4

8 Lead Plastic ESOIC

5

TXAOUT and TXBOUT Shorted to Ground

6,7,8

PACKAGE STYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, Tj C

DATA RATE

1

2

°

°°

°

°

°

°

Ta=25 C

Ta=85 C

Ta=125 C

Ta=25 C

Ta=85 C

Ta=125 C

Low Speed

20.98

20.96

20.96

38.24

98.34

138.92

High Speed

26.40

26.16

25.96

44.78

104.66

144.59

3

4

8 Lead Plastic ESOIC

5

Maximum ARINC Load

HI-8570, HI-8571

HOLT INTEGRATED CIRCUITS

5