NT2H1311G0DUF datasheet(6/58 Pages) NXP

Part #	NT2H1311G0DUF

Description	NFC Forum Type 2 Tag compliant IC with 144/504/888 bytes user memory

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Manufacturer	NXP [NXP Semiconductors]

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NTAG213_215_216

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Product data sheet

COMPANY PUBLIC

Rev. 3.0 — 24 July 2013

265330

6 of 58

NXP Semiconductors

NTAG213/215/216

NFC Forum T2T compliant IC with 144/504/888 bytes user memory

7.

Pinning information

7.1 Pinning

The pinning of the NTAG213/215/216 wafer delivery is shown in section “Bare die outline”

(see Section 13.2).

8.

Functional description

8.1 Block description

NTAG21x ICs consist of a 180 (NTAG213), 540 bytes (NTAG215) or 924 bytes

(NTAG216) EEPROM, RF interface and Digital Control Unit (DCU). Energy and data are

transferred via an antenna consisting of a coil with a few turns which is directly connected

to NTAG21x. No further external components are necessary. Refer to Ref. 4 for details on

antenna design.

• RF interface:

– modulator/demodulator

– rectifier

– clock regenerator

– Power-On Reset (POR)

– voltage regulator

• Anticollision: multiple cards may be selected and managed in sequence

• Command interpreter: processes memory access commands supported by the

NTAG21x

• EEPROM interface

• NTAG213 EEPROM: 180 bytes, organized in 45 pages of 4 byte per page.

– 26 bytes reserved for manufacturer and configuration data

– 34 bits used for the read-only locking mechanism

– 4 bytes available as capability container

– 144 bytes user programmable read/write memory

• NTAG215 EEPROM: 540 bytes, organized in 135 pages of 4 byte per page.

– 26 bytes reserved for manufacturer and configuration data

– 28 bits used for the read-only locking mechanism

– 4 bytes available as capability container

– 504 bytes user programmable read/write memory

• NTAG216 EEPROM: 924 bytes, organized in 231 pages of 4 byte per page.

– 26 bytes reserved for manufacturer and configuration data

Table 3.

Pin allocation table

Symbol

LA

Antenna connection LA

LB

Antenna connection LB

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