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CSD87588N Datasheet(PDF) 3 Page - Texas Instruments |
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CSD87588N Datasheet(HTML) 3 Page - Texas Instruments |
3 / 20 page CSD87588N www.ti.com SLPS384A – MARCH 2013 – REVISED MAY 2013 THERMAL INFORMATION TA = 25°C (unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT Junction to ambient thermal resistance (Min Cu) (1) 170 RθJA Junction to ambient thermal resistance (Max Cu) (2)(1) 70 °C/W Junction to case thermal resistance (Top of package) (1) 3.7 RθJC Junction to case thermal resistance (PGND Pin) (1) 1.25 (1) RθJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2 oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2) Cu. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 |
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