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EP1C6F400I8ES Datasheet(PDF) 4 Page - Altera Corporation |
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EP1C6F400I8ES Datasheet(HTML) 4 Page - Altera Corporation |
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4 / 106 page  1–2 Altera Corporation Preliminary May 2008 Cyclone Device Handbook, Volume 1 Cyclone devices are available in quad flat pack (QFP) and space-saving FineLine® BGA packages (see Tables 1–2 through 1–3). Vertical migration means you can migrate a design from one device to another that has the same dedicated pins, JTAG pins, and power pins, and are subsets or supersets for a given package across device densities. The largest density in any package has the highest number of power pins; you must use the layout for the largest planned density in a package to provide the necessary power pins for migration. For I/O pin migration across densities, cross-reference the available I/O pins using the device pin-outs for all planned densities of a given package type to identify which I/O pins can be migrated. The Quartus® II software can automatically cross-reference and place all pins for you when given a device migration list. If one device has power or ground pins, but these same pins are user I/O on a different device that is in the migration path,the Quartus II software ensures the pins are not used as user I/O in the Quartus II software. Ensure that these pins are connected Total RAM bits 59,904 78,336 92,160 239,616 294,912 PLLs 12222 Maximum user I/O pins (1) 104 301 185 249 301 Note to Table 1–1: (1) This parameter includes global clock pins. Table 1–1. Cyclone Device Features (Part 2 of 2) Feature EP1C3 EP1C4 EP1C6 EP1C12 EP1C20 Table 1–2. Cyclone Package Options and I/O Pin Counts Device 100-Pin TQFP (1) 144-Pin TQFP (1), (2) 240-Pin PQFP (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 400-Pin FineLine BGA EP1C3 65 104 — — — — EP1C4 ———— 249 301 EP1C6 — 98 185 185 — — EP1C12 — — 173 185 249 — EP1C20 ———— 233 301 Notes to Table 1–2: (1) TQFP: thin quad flat pack. PQFP: plastic quad flat pack. (2) Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package). |
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