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HI-8591PDMF-40 Datasheet(PDF) 8 Page - Holt Integrated Circuits |
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HI-8591PDMF-40 Datasheet(HTML) 8 Page - Holt Integrated Circuits |
8 / 8 page HI-8591 PACKAGE DIMENSIONS 8-PIN PLASTIC DIP .385 ±.015 (9.799 ±.381) .025 ±.010 (.635 ± .254) .335 ±.035 (8.509 ±.889) .250 ± .010 (6.350 ±.254) .100 BSC (2.54) .135 ±.015 (3.429 ±.381) .055 ±.010 (1.397 ±.254) .1375 ±.0125 (3.493 ±.318) .019 ±.002 (.483 ±.102) .0115 ±.0035 (.292 ±.089) .300 ±.010 (7.620 ±.254) inches (millimeters) Package Type: 8P BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 16-PIN PLASTIC CHIP-SCALE PACKAGE inches (millimeters) Package Type: 16PCS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Top View Bottom View Electrically isolated heat sink pad on bottom of package Connect to any ground or power plane for optimum thermal dissipation . . .157 (4.000) BSC .157 (4.000) BSC .039 (1.000) max. .008 (.200) typ. .016 ± .002 (.400 ± .050) .102 ± .002 (2.600 ± .050) .026 (.650) BSC .012 ± .002 (.300 ± .050) .102 ± .002 (2.600 ± .050) HOLT INTEGRATED CIRCUITS 8 |
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