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HC240 Datasheet(PDF) 11 Page - Altera Corporation

Part # HC240
Description  Package Information Datasheet for Mature Altera Devices
Download  182 Pages
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Manufacturer  ALTERA [Altera Corporation]
Direct Link  http://www.altera.com
Logo ALTERA - Altera Corporation

HC240 Datasheet(HTML) 11 Page - Altera Corporation

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Package Information Datasheet for Mature Altera Devices
11
Device and Package Cross Reference
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
HardCopy II Devices
Table 10 lists the device name, package type, and number of pins for the HardCopy II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
HardCopy Devices
Table 11 lists the device name, package type, and number of pins for the HardCopy
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
EPM3256A
TQFP, Wire Bond
144
PQFP, Wire Bond
208
EPM3512A
PQFP, Wire Bond
208
FBGA, Wire Bond, Option 1
256
Table 9. MAX 3000A Devices (Part 2 of 2)
Device
Package
Pins
Table 10. HardCopy II Devices
Device
Package
Pins
HC210
FBGA, Wire Bond, A:2.40
484
HC220
Single-Piece Lid: FBGA, Flip Chip, Option 4
672
Single-Piece Lid: FBGA, Flip Chip, Option 3
780
HC230
Single-Piece Lid: FBGA, Flip Chip, Option 2
1020
HC240
Single-Piece Lid: FBGA, Flip Chip, Option 2
1020
Single-Piece Lid: FBGA, Flip Chip, Option 2
1508
Table 11. HardCopy Devices
Device
Package
Pins
HC1S25
FBGA, Wire Bond, A:2.40
672
BGA, Wire Bond
672
HC1S30
Dual-Piece Lid: FBGA, Flip Chip, Option 1
780
HC1S40
Dual-Piece Lid: FBGA, Flip Chip, Option 1
780
HC1S60
Dual-Piece Lid: FBGA, Flip Chip, Option 1
1020
HC1S80
Dual-Piece Lid: FBGA, Flip Chip, Option 1
1020


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