ORDERING INFORMATION

HI - 8591

-

xx x

xx

x

INPUT SERIES RESISTANCE

BUILT-IN

REQUIRED EXTERNALLY

PART

NUMBER

100 Kohm

40 Kohm

-40

140 Kohm

0

No dash number

TEMPERATURE

RANGE

FLOW

BURN

IN

-40°C TO +85°C

-55°C TO +125°C

NO

YES

I

M

-55°C TO +125°C

NO

T

PART

NUMBER

T

I

M

PACKAGE

DESCRIPTION

8 PIN PLASTIC DIP (8P) not available with “M” flow

16 PIN PLASTIC4x4mm CHIP SCALE (16PCS) not available with “M” flow

PART

NUMBER

PD

PC

8 PIN PLASTIC NARROW BODY SOIC (8HN)

8 PIN CERDIP (8D) not available Pb-free

PS

CR

LEAD

FINISH

PART

NUMBER

100% Matte Tin (Pb-free, RoHS compliant)

F

Tin / Lead (Sn / Pb) Solder

Blank

The HI-8591PCI and HI-8591PCT use a 16-pin plastic

chip-scale (QFN) package. This package has a metal heat

sink pad on its bottom surface. This heat sink should be

soldered down to the printed circuit board for optimum

thermal dissipation. The heat sink is electrically isolated

from the chip and can be soldered to any ground or power

plane. However, since the chip’s substrate is at V+,

connecting the heat sink to this power plane is

recommended to avoid coupling noise into the circuit.

HEAT SINK - CHIP-SCALE PACKAGE ONLY

HI-8591

HOLT INTEGRATED CIRCUITS

5