MMDL301T1G

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3

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING

WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF RADIUS.

NOTE 3

D

1

2

b

E

A3

A1

A

C

NOTE 5

L

1.60

0.063

0.63

0.025

0.83

0.033

2.85

0.112

DIM MIN

NOM

MAX

MILLIMETERS

A

0.80

0.90

1.00

A1

0.00

0.05

0.10

A3

0.15 REF

b

0.25

0.32

0.4

C 0.089

0.12 0.177

D

1.60

1.70

1.80

E

1.15

1.25

1.35

0.08

2.30

2.50

2.70

L

0.031 0.035 0.040

0.000 0.002 0.004

0.006 REF

0.010 0.012 0.016

0.003 0.005 0.007

0.062 0.066 0.070

0.045 0.049 0.053

0.003

0.090 0.098 0.105

MIN

NOM

MAX

INCHES

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 1:

PIN 1. CATHODE (POLARITY BAND)

2. ANODE

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