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BUJ302AD Datasheet(PDF) 5 Page - NXP Semiconductors |
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BUJ302AD Datasheet(HTML) 5 Page - NXP Semiconductors |
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5 / 14 page  BUJ302AD All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 01 — 28 March 2011 5 of 14 NXP Semiconductors BUJ302AD NPN power transistor 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 5 --1.56 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse width 001aab998 tp (s) 10−5 110 10−1 10−2 10−4 10−3 1 10−1 10 Zth(j-mb) (K/W) 10−2 δ = 0.5 0.2 0.1 tp tp T Ptot t T δ = 0.01 0.05 0.02 |
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