LM7301 datasheet(3/28 Pages) TI

Part #	LM7301

Description	DAC081S101 8-Bit Micro Power Digital-to-Analog Converter with Rail-to-Rail Output

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Manufacturer	TI [Texas Instruments]

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I/O

GND

TO INTERNAL

CIRCUITRY

DAC081S101

www.ti.com

SNAS323C – JUNE 2005 – REVISED FEBRUARY 2013

Absolute Maximum Ratings

(1) (2)

Supply Voltage, VA

6.5V

Voltage on any Input Pin

−0.3V to (VA + 0.3V)

Input Current at Any Pin(3)

10 mA

Package Input Current(3)

20 mA

Power Consumption at TA = 25°C

See(4)

ESD Susceptibility(5)

Human Body Model

2500V

Machine Model

250V

Soldering Temperature, Infrared,

10 Seconds (6)

235°C

Storage Temperature

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified

(3)

When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than VA), the current at that pin should

be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of 10 mA to two.

(4)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe

fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).

Obviously, such conditions should always be avoided.

(5)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through ZERO

Ohms.

(6)

See the section entitled "Surface Mount" found in any post 1986 National Semiconductor Linear Data Book for methods of soldering

surface mount devices.

Operating Ratings

(1) (2)

Operating Temperature Range

−40°C ≤ TA ≤ +105°C

Supply Voltage, VA

(3)

+2.7V to 5.5V

Any Input Voltage(4)

−0.1 V to (VA + 0.1 V)

Output Load

0 to 1500 pF

SCLK Frequency

Up to 30 MHz

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified

(3)

To guarantee accuracy, it is required that VA be well bypassed.

(4)

The analog inputs are protected as shown below. Input voltage magnitudes up to VA + 300 mV or to 300 mV below GND will not

damage this device. However, errors in the conversion result can occur if any input goes above VA or below GND by more than 100 mV.

For example, if VA is 2.7VDC, ensure that −100mV ≤ input voltages ≤2.8VDC to ensure accurate conversions.

Package Thermal Resistances

Package

θJA

8-Lead VSSOP

240°C/W

6-Lead SOT

250°C/W

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