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AGLN030V2-CSG100PP Datasheet(PDF) 1 Page - Microsemi Corporation

Part # AGLN030V2-CSG100PP
Description  IGLOO nano Low Power Flash FPGAs with Flash*Freeze Technology
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

AGLN030V2-CSG100PP Datasheet(HTML) 1 Page - Microsemi Corporation

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June 2013
I
© 2013 Microsemi Corporation
IGLOO nano Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
• nanoPower Consumption—Industry’s Lowest Power
• 1.2 V to 1.5 V Core Voltage Support for Low Power
• Supports Single-Voltage System Operation
• Low Power Active FPGA Operation
• Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
Small Footprint Packages
• As Small as 3x3 mm in Size
Wide Range of Features
• 10,000 to 250,000 System Gates
• Up to 36 kbits of True Dual-Port SRAM
• Up to 71 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal, Flash-Based CMOS Process
• Instant On Level 0 Support
• Single-Chip Solution
• Retains Programmed Design When Powered Off
• 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
In-System Programming (ISP) and Security
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock® Designed to Secure FPGA Contents
•1.2 V Programming
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3V /2.5 V / 1.8V /1.5 V/1.2 V
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Selectable Schmitt Trigger Inputs
• Hot-Swappable and Cold-Sparing I/Os
• Programmable Output Slew Rate and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO® Family
Clock Conditioning Circuit (CCC) and PLL
• Up to Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
• True Dual-Port SRAM (except × 18 organization)†
Enhanced Commercial Temperature Range
• Tj = -20°C to +85°C
† AGLN030 and smaller devices do not support this feature.
IGLOO nano Devices
AGLN010 AGLN0151 AGLN020
AGLN060
AGLN125
AGLN250
IGLOO nano-Z Devices1
AGLN030Z1
AGLN060Z1 AGLN125Z1 AGLN250Z1
System Gates
10,000
15,000
20,000
30,000
60,000
125,000
250,000
Typical Equivalent Macrocells
86
128
172
256
512
1,024
2,048
VersaTiles (D-flip-flops)
260
384
520
768
1,536
3,072
6,144
Flash*Freeze Mode (typical, µW)
2
4
4
5
10
16
24
RAM Kbits (1,024 bits)2
18
36
36
4,608-Bit Blocks2
––
4
8
8
FlashROM Kbits (1,024 bits)
1
1
1
1
1
1
1
Secure (AES) ISP2
––
Yes
Yes
Yes
Integrated PLL in CCCs 2,3
––
1
1
1
VersaNet Globals
4
4
4
6
18
18
18
I/O Banks
2
3
3
2
2
2
4
Maximum User I/Os (packaged device)
34
49
52
77
71
71
68
Maximum User I/Os (Known Good Die)
34
52
83
71
71
68
Package Pins
UC/CS
QFN
VQFP
UC36
QN48
QN68
UC81,
CS81
QN68
UC81, CS81
QN48, QN68
VQ100
CS81
VQ100
CS81
VQ100
CS81
VQ100
Notes:
1. Not recommended for new designs.
2. AGLN030 and smaller devices do not support this feature.
3. AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.
4. For higher densities and support of additional features, refer to the IGLOO and IGLOOe datasheets.
Revision 17


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