Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the

Cree logo are registered trademarks, and DA and DA1000 are trademarks of Cree, Inc.

2

CPR3ES Rev A

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com

Maximum Ratings at T

Notes 1,2 & 3

CxxxDA1000-Sxx000

DCForwardCurrent

1000mA

PeakForwardCurrent(1/10dutycycle@1kHz)

1250mA

LEDJunctionTemperature

150°C

ReverseVoltage

5V

OperatingTemperatureRange

-40°Cto+100°C

StorageTemperatureRange

-40°Cto+100°C

Typical Electrical/Optical Characteristics at T

Note 2

Part Number

Forward Voltage (V

Reverse Current

[I(Vr=5V), μA]

Full Width Half Max

(

λ

Min.

Typ.

Max.

Max.

Typ.

C450DA1000-Sxx000

2.7

3.15

3.5

2

20

C460DA1000-Sxx000

2.7

3.15

3.5

2

21

Mechanical Specifications

CxxxDA1000-Sxx000

Description

Dimension

Tolerance

P-NJunctionArea(μm)

960x960

±35

ChipBottomArea(μm)

1000x1000

±35

ChipTopArea(μm)

630x630

±45

ChipThickness(μm)

335

±25

AuSnBondPadWidth–Anode(um)

75

±15

AuSnBondPadLength–Anode(um)

945

±35

AuSnBondPadWidth–Cathode(um)

795

±35

AuSnBondPadLength–Cathode(um)

945

±35

BondPadGap(μm)

75

±15

AuSnBondPadThickness(μm)

3

±0.5

Notes:

1.

Maximum ratings are package-dependent. The above ratings were determined using a Cree 3.45-mm x 3.45-mm SMT package (with silicone

encapsulation and intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be

characterizedinaspecificpackagetodeterminelimitations.Assemblyprocessingtemperaturemustnotexceed325°C(<5seconds).

2.

Allproductsconformtothelistedminimumandmaximumspecificationsforelectricalandopticalcharacteristicswhenassembledandoperatedat350

mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgivenarewithintherangeofaveragevalues

expectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.AllmeasurementsweremadeusinglampsinT-1¾packages(with

HysolOS4000epoxyencapsulantandintrinsicAuSnmetaldieattach).OpticalcharacteristicsmeasuredinanintegratingsphereusingIlluminanceE.

3.

ThemaximumforwardcurrentisdeterminedbythethermalresistancebetweentheLEDjunctionandambient.Itiscrucialfortheend-producttobe

designedinamannerthatminimizesthethermalresistancefromtheLEDjunctiontoambientinordertooptimizeproductperformance.

0

200

400

600

800

1000

1200

25

50

75

100

125

150

175

Ambient Temperature (

C)