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C460EZ290-0211-2 Datasheet(PDF) 2 Page - Cree, Inc

Part # C460EZ290-0211-2
Description  EZBright LED RF Performance Lambertian Radiation
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Manufacturer  CREE [Cree, Inc]
Direct Link  http://www.cree.com/
Logo CREE - Cree, Inc

C460EZ290-0211-2 Datasheet(HTML) 2 Page - Cree, Inc

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Copyright©2010Cree,Inc.Allrightsreserved.Theinformationinthisdocumentissubjecttochangewithoutnotice.Cree,theCree
logoandEZBrightareregisteredtrademarks,andEZ,EZ290,EZ-08,EZ-18andEZ-21aretrademarksofCree,Inc.
2
CPR3EJ Rev -
Cree,Inc.
4600SiliconDrive
Durham,NC27703
USATel:+1.919.313.5300
www.cree.com
Maximum Ratings at T
A = 25°C
Notes 1&3
CxxxEZ290-Sxx00-2
DCForwardCurrent
50mA
PeakForwardCurrent(1/10dutycycle@1kHz)
100mA
LEDJunctionTemperature
125°C
ReverseVoltage
5V
OperatingTemperatureRange
-40°Cto+100°C
StorageTemperatureRange
-40°Cto+100°C
ElectrostaticDischargeThreshold(HBM)Note2
1000V
ElectrostaticDischargeClassification(MIL-STD-883E)Note2
Class2
Typical Electrical/Optical Characteristics at T
A = 25°C, If = 20 mA
Note 3
Part Number
Forward Voltage (V
f, V)
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
(
λ
D, nm)
Min.
Typ.
Max.
Max.
Typ.
C460EZ290-Sxx00-2
2.7
3.1
3.7
2
21
C470EZ290-Sxx00-2
2.7
3.1
3.7
2
22
C527EZ290-Sxx00-2
2.9
3.2
3.9
2
35
Mechanical Specifications
CxxxEZ290-Sxx00-2
Description
Dimension
Tolerance
P-NJunctionArea(μm)
226x226
±25
TopArea(μm)
280x280
±25
BottomArea(μm)
280x280
±25
ChipThickness(μm)
170
±25
AuBondPadDiameter(μm)
100
-15,+5
AuBondPadThickness(μm)
3.0
±1.0
BackContactMetalArea(μm)
280x280
±25
BackContactMetalThickness(μm)Note4
3.0
±0.3
Notes:
1. Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy)forcharacterization.Ratingsforotherpackagesmaydiffer.Theforwardcurrents(DCandPeak)arenotlimitedbythedie
butbytheeffectoftheLEDjunctiontemperatureonthepackage.Thejunctiontemperaturelimitof125°CisalimitoftheT-1
3/4package;junctiontemperatureshouldbecharacterizedinaspecificpackagetodeterminelimitations.Assemblyprocessing
temperaturemustnotexceed325°C(<5seconds).SeeCreeEZBrightApplicationsNoteforassemblyprocessinformation.
2. Productresistancetoelectrostaticdischarge(ESD)accordingtotheHBMismeasuredbysimulatingESDusingarapidavalanche
energytest(RAET).TheRAETproceduresaredesignedtoapproximatethemaximumESDratingsshown.TheRAETprocedureis
performedoneachdie.TheESDclassificationofClass2isbasedonsampletestingaccordingtoMIL-STD-883E.
3. Allproductsconformtothelistedminimumandmaximumspecificationsforelectricalandopticalcharacteristicswhenassembled
andoperatedat20mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgiven
arewithintherangeofaveragevaluesexpectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.All
measurementsweremadeusinglampsinT-13/4packages(withHysolOS4000epoxy).Opticalcharacteristicsmeasuredinan
integratingsphereusingIlluminanceE.
4. Specificationsaresubjecttochangewithoutnotice.


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