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Data Sheet

1

o

This data sheet is applied for LC Combined CHIP EMIFILr used for General Electronics equipment for your design.

2005.3.4

Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr LC Combined Type > Winding Type

(1) : Input electrode

(2) : Ground electrode

(3) : Output electrode

(1)

(2)

(3)

2.3

±0.2

0.7

±0.3

0.65

±0.2

0.7

±0.3

1.6

±0.2

3.2

±0.3

∗No polarity.

(in mm)

0

20

40

80

110

5

50

100

500

1000

2000

NFW31SP106X1E4

NFW31SP207X1E4

NFW31SP507X1E4

Frequency (MHz)

NFW31SP506X1E4

60

NFW31SP206X1E4

NFW31SP157X1E4

NFW31SP107X1E4

NFW31SP307X1E4

NFW31SP407X1E4

(50

Ω - 50Ω)

GND

(2)

(1) Input

Output (3)

No polarity.

Chip EMIFILr LC Combined Type

NFW31SP Series (1206 Size)

I Dimension

I IL of Main Items

I Equivalent Circuit

I Packaging

Code

Packaging

Minimum Quantity

L

180mm Plastic Tape

2000

K

330mm Plastic Tape

7500

I Rated Value (p: packaging code)

Part Number

Nominal Cut-off Freq.

Insertion Loss

(Cut-off Frequency)

Attenuation at 500MHz

Attenuation at 1000MHz

Rated Current

Rated Voltage

Operating

Temperature Range

Number of Circuit

NFW31SP106X1E4p

10MHz

6dB max.

30dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP206X1E4p

20MHz

6dB max.

30dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP506X1E4p

50MHz

6dB max.

30dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP107X1E4p

100MHz

6dB max.

20dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP157X1E4p

150MHz

6dB max.

30dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP207X1E4p

200MHz

6dB max.

10dBmin.

30dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP307X1E4p

300MHz

6dB max.

5dBmin.

15dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP407X1E4p

400MHz

6dB max.

-

10dBmin.

200mA

25Vdc

-40

°C to 85°C

1

NFW31SP507X1E4p

500MHz

6dB max.

6dBmax.

10dBmin.

200mA

25Vdc

-40

°C to 85°C

1

!Caution (Rating)

Do not use products beyond the rated current and

rated voltage as this may create excessive heat

and deteriorate the insulation resistance .

Notice

Solderability of Tin plating termination chip might be

deteriorated when low temperature soldering profile

where peak solder temperature is below the Tin melting

point is used. Please confirm the solderability of Tin

plating termination chip before use.

I !Caution/Notice