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MT47H64M8B6-25ELDTR Datasheet(PDF) 11 Page - Micron Technology |
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MT47H64M8B6-25ELDTR Datasheet(HTML) 11 Page - Micron Technology |
11 / 133 page Automotive Temperature The automotive temperature (AT) option, if offered, has two simultaneous require- ments: ambient temperature surrounding the device cannot be less than –40°C or great- er than 105°C, and the case temperature cannot be less than –40°C or greater than 105°C. JEDEC specifications require the refresh rate to double when TC exceeds 85°C; this also requires use of the high-temperature self refresh option. Additionally, ODT re- sistance the input/output impedance and IDD values must be derated when TC is < 0°C or > 85°C. General Notes • The functionality and the timing specifications discussed in this data sheet are for the DLL-enabled mode of operation. • Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ term is to be interpreted as any and all DQ collectively, unless specifically stated oth- erwise. Additionally, the x16 is divided into 2 bytes: the lower byte and the upper byte. For the lower byte (DQ[7:0]), DM refers to LDM and DQS refers to LDQS. For the up- per byte (DQ[15:8]), DM refers to UDM and DQS refers to UDQS. • A x16 device's DQ bus is comprised of two bytes. If only one of the bytes needs to be used, use the lower byte for data transfers and terminate the upper byte as noted: – Connect UDQS to ground via 1k Ω* resistor – Connect UDQS# to VDD via 1kΩ* resistor – Connect UDM to VDD via 1kΩ* resistor – Connect DQ[15:8] individually to either VSS or VDD via 1kΩ* resistors, or float DQ[15:8]. *If ODT is used, 1k Ω resistor should be changed to 4x that of the selected ODT. • Complete functionality is described throughout the document, and any page or dia- gram may have been simplified to convey a topic and may not be inclusive of all re- quirements. • Any specific requirement takes precedence over a general statement. 512Mb: x4, x8, x16 DDR2 SDRAM Functional Description PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. T 2/12 EN 11 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2004 Micron Technology, Inc. All rights reserved. |
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