IS43/46DR16128

Integrated Silicon Solution, Inc. – www.issi.com –

1

Rev. B, 09/6/2012

2Gb (x16) DDR2 SDRAM

FEATURES

• Clock frequency up to 333MHz (667 MT/s Data Rate)

• 8 internal banks for concurrent operation

• 4-bit prefetch architecture

• Programmable CAS Latency: 3, 4, 5, 6 and 7

• Programmable Additive Latency: 0, 1, 2, 3, 4, 5 and 6

• Write Latency = Read Latency-1

• Programmable Burst Sequence: Sequential or

Interleave

• Programmable Burst Length: 4 and 8

• Automatic and Controlled Precharge Command

• Power Down Mode

• Auto Refresh and Self Refresh

• Refresh Interval: 7.8 µs (8192 cycles/64 ms)

• OCD (Off-Chip Driver Impedance Adjustment)

• ODT (On-Die Termination)

• Weak Strength Data-Output Driver Option

• Bidirectional differential Data Strobe (Single-ended

data-strobe is an optional feature)

• On-Chip DLL aligns DQ and DQs transitions with CK

transitions

• DQS# can be disabled for single-ended data strobe

• Differential clock inputs CK and CK#

• VDD and VDDQ = 1.8V ± 0.1V

• PASR (Partial Array Self Refresh)

• SSTL_18 interface

• tRAS lockout supported

• Operating temperature:

2

2

2

OPTIONS

• Configuration:

− 128Mx16 (two stacked 16M x 8 x8 banks)

• Package:

− 84-ball FBGA

ADDRESS TABLE

Parameter

128Mx16

Row Addressing

A0-A13

Column Addressing

A0-A9

Bank Addressing

BA0-BA2

Precharge Addressing

A10

Clock Cycle Timing

-37C

-3D

Units

Speed Grade

DDR2-533C

DDR2-667D

CL-tRCD-tRP

4-4-4

5-5-5

tCK

tCK (CL=3)

5

5

ns

tCK (CL=4)

3.75

3.75

ns

tCK (CL=5)

3.75

3

ns

tCK (CL=6)

3.75

3

ns

tCK (CL=7)

3.75

3

ns

Frequency (max)

266

333

MHz

Note:

1.

The -37C device specifications is shown for reference only.

2.

Please contact ISSI for availability of Automotive parts.

SEPTEMBER 2012

Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can

reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such

applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:

a.) the risk of injury or damage has been minimized;

b.) the user assume all such risks; and

c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances