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AXK780147G Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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AXK780147G Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 12 page Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ AXK7, 8 ACCTB3E 201212-T SPECIFICATIONS 1. Characteristics 2. Material and surface treatment Item Specification Conditions Electrical characteristics Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Breakdown voltage 150V AC for 1 min. Detection current: 1mA Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 70mΩ Based on the contact resistance measurement method specified y JIS C 5402. Mechanical characteristics Composite insertion force Max. 0.981N {100gf}/pin contacts × pin contacts (initial) Composite removal force Min. 0.0588N {6gf}/pin contacts × pin contacts (Mated height 1.5 mm without soldering terminals type) Min. 0.118N {12gf}/pin contacts × pin contacts All the other types except the above (Mated height 1.5 mm without soldering terminals type) Post holding force Min. 0.981N {100gf}/pin contacts Measuring the maximum force. As the contact is axially pull out. Environmental characteristics Ambient temperature –55°C to +85°C No freezing at low temperatures Soldering heat resistance Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals) Infrared refl w soldering 300°C within 5 sec. 350°C within 3 sec. Soldering iron Storage temperature –55°C to +85°C (product only) –40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation. Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 70mΩ Conformed to MIL-STD-202F, method 107G Humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ Bath temperature 40±2°C, humidity 90 to 95% R.H. Saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ Bath temperature 35±2°C, saltwater concentration 5±1% H2S resistance (header and socket mated) 48 hours, contact resistance max. 70mΩ Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Lifetime characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours Unit weight Mated height 1.5mm, 20 pin contacts; Socket: 0.04g Header: 0.02g Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact and Post Copper alloy Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) However, upper terminal of Ni barrier production: Exposed over Ni The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base. Soldering terminals portion Copper alloy Ni plating on base, Sn plating on surface (Except for front terminal) Order Temperature (°C) Time (minutes) 1 2 3 4 –55 85 –55 0 −3 30 Max. 5 30 Max. 5 +3 0 0 −3 |
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