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ATF-55143-TR2G Datasheet(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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ATF-55143-TR2G Datasheet(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
2 / 20 page 2 ATF-55143 Absolute Maximum Ratings[1] Absolute Symbol Parameter Units Maximum V DS Drain-Source Voltage[2] V 5 V GS Gate-Source Voltage[2] V -5 to 1 V GD Gate Drain Voltage [2] V -5 to 1 I DS Drain Current[2] mA 100 I GS Gate Current[5] mA 1 P diss Total Power Dissipation [3] mW 270 P in max. RF Input Power[5] (Vds=2.7V, Ids=10mA) dBm 10 (Vds=0V, Ids=0mA) dBm 10 T CH Channel Temperature °C 150 T STG Storage Temperature °C -65 to 150 jc Thermal Resistance [4] °C/W 235 ESD (Human Body Model) V 200 ESD (Machine Model) V 25 Notes: 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Assumes DC quiescent conditions. 3. Source lead temperature is 25°C. Derate 4.3 mW/°C for T L > 87°C. 4. Thermal resistance measured using 150°C Liquid Crystal Measure- ment method. 5. Device can safely handle +10 dBm RF Input Power as long as I GS is limited to 1 mA. I GS at P 1dB drive level is bias circuit dependent. See applications section for additional information. Product Consistency Distribution Charts [6, 7] VDS (V) Figure 1. Typical I-V Curves. (VGS = 0.1 V per step) 0.4V 0.3V 0.5V 0.6V 0.7V 02 14 6 5 37 70 60 50 40 30 20 10 0 OIP3 (dBm) Figure 2. OIP3 @ 2.7 V, 10 mA. LSL = 22.0, Nominal = 24.2 22 23 25 24 26 300 250 200 150 100 50 0 Cpk = 2.02 Stdev = 0.36 -3 Std GAIN (dB) Figure 3. Gain @ 2.7 V, 10 mA. USL = 18.5, LSL = 15.5, Nominal = 17.7 15 17 16 18 19 200 160 120 80 40 0 Cpk = 1.023 Stdev = 0.28 -3 Std +3 Std NF (dB) Figure 4. NF @ 2.7 V, 10 mA. USL = 0.9, Nominal = 0.6 0.43 0.63 0.53 0.83 0.73 0.93 240 200 160 120 80 40 0 Cpk = 3.64 Stdev = 0.031 +3 Std Notes: 6. Distribution data sample size is 500 samples taken from 6 different wafers. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limits. 7. Measurements made on production test board. This circuit represents a trade-off between an optimal noise match and a realizeable match based on production test equipment. Circuit losses have been de-embedded from actual measurements. |
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