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ACSL-6210-00RE Datasheet(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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ACSL-6210-00RE Datasheet(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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7 / 19 page  7 Solder Reflow Temperature Profile Recommended Pb-free IR Profile Note: Non-halide flux should be used Note: Non-halide flux should be used 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160 °C 140 C 150 °C° PEAK TEMP. 245 °C PEAK TEMP. 240 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C PREHEATING TIME 150 C, 90 ± 30 SEC. 2.5 °C ± 0.5 °C/SEC. 3 °C + 1 °C/–0.5 °C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. |
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