When subjecting leads to mechanical stress, the following should be observed:

Tensile stress on leads

During mounting and operation tensile forces on the leads are to be avoided.

Bending of leads

Bending of the leads directly on the thermistor body is not permissible.

A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder

joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.

The bending radius should be at least 0.75 mm.

Twisting of leads

The twisting (torsion) by 180

° of a lead bent by 90° is permissible at 6 mm from the bottom of the

thermistor body.

3

Sealing and potting

When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused

by thermal expansion during the production process (curing / overmolding process) and during

later operation. The upper category temperature of the thermistor must not be exceeded. Ensure

that the materials used (sealing / potting compound and plastic material) are chemically neutral.

4

Cleaning

If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are

recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are

permissible.

5

Storage

In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.

Humidity, temperature and container materials are critical factors.

The components should be left in the original packing. Touching the metallization of unsoldered

thermistors may change their soldering properties.

Storage temperature:

25

°C up to 45 °C

Max. relative humidity (without condensation):

<95%, maximum 30 days per annum

Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-

fied:

Leaded components:

24 months

Inrush current limiters

B57153S0***M0**

ICLs

S153

Page 9 of 14

Please read Cautions and warnings and

Important notes at the end of this document.