BAS70H.115 datasheet(11/20 Pages) NXP

Part #	BAS70H.115

Description	General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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11 / 20 page

BAS70_1PS7XSB70_SER_9

Product data sheet

Rev. 09 — 13 January 2010

11 of 20

NXP Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

10. Soldering

Dimensions in mm

Fig 14. Reflow soldering footprint SOD323 (SC-76)

Dimensions in mm

Fig 15. Wave soldering footprint SOD323 (SC-76)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 16. Reflow soldering footprint SOD523 (SC-79)

msa433

1.65

0.50

(2

×)

2.10

1.60

2.80

0.60

3.05

0.50

0.95

solder lands

solder resist

occupied area

solder paste

msa415

1.40

4.40

5.00

1.20

2.75

preferred transport direction during soldering

solder lands

solder resist

occupied area

mgs343

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15

solder lands

solder resist

occupied area

solder paste

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BAS70H.115 Datasheet(PDF) 11 Page - NXP Semiconductors

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