Electronic Components Datasheet Search |
|
BAS70H.115 Datasheet(PDF) 11 Page - NXP Semiconductors |
|
BAS70H.115 Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 20 page BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 11 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reflow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2 ×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste msa415 1.40 4.40 5.00 1.20 2.75 preferred transport direction during soldering solder lands solder resist occupied area mgs343 1.80 1.90 0.30 0.40 0.50 1.20 0.60 2.15 solder lands solder resist occupied area solder paste |
Similar Part No. - BAS70H.115 |
|
Similar Description - BAS70H.115 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |