ADG820BRM datasheet(4/12 Pages) AD

Part #	ADG820BRM

Description	0.5 n CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switches

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ADG819/ADG820

ABSOLUTE MAXIMUM RATINGS

1

(TA = 25

°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Digital Inputs

2 . . . . . . . . . . . . . . . . . –0.3 V to V

DD + 0.3 V or

. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA

. . . . . . . . . . . . . . . .(Pulsed at 1 ms, 10% Duty Cycle Max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA

Operating Temperature Range

Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

µSOIC Package

!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W

!

JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44

°C/W

SOT-23 Package (4-Layer Board)

!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W

MicroCSP Package

!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235

°C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

Table I. Truth Table for the ADG819/ADG820

IN

Switch S1

Switch S2

0

ON

OFF

1

OFF

ON

PIN CONFIGURATIONS

6-Lead SOT-23

8-Lead

µSOIC

(RJ-6)

(RM-8)

TOP VIEW

(Not to Scale)

6

2

ADG820

5

4

1

3

ADG819/

S2

D

IN

TOP VIEW

(Not to Scale)

8

7

6

5

1

2

3

4

ADG819/

ADG820

S2

NC

D

S1

IN

VDD

GND

VDD

S1

GND

NC

NC = NO CONNECT

ORDERING GUIDE

Model Option

Temperature Range

Brand

1

Package Description

Package

ADG819BRM

ADG819BRT

ADG819BCB

ADG820BRM

ADG820BRT

–40

°C to +125°C

–40

°C to +125°C

–40

°C to +85°C

–40

°C to +125°C

–40

°C to +125°C

SNB

SPB

µSOIC (MicroSmall Outline IC)

SOT-23 (Plastic Surface-Mount)

MicroCSP (Micro Chip Scale Package)

µSOIC (MicroSmall Outline IC)

SOT-23 (Plastic Surface-Mount)

RM-8

RJ-6

2

CB-62

RM-8

RJ-6

2

NOTES

1Branding on these packages is limited to three characters due to space constraints.

2Contact factory for availability.

2

X 3 MicroCSP

TOP VIEW

(BUMPS AT THE BOTTOM)

NOT TO SCALE

S2

1

IN

6

D

2

VDD

5

S1

3

GND

4

ADG819 ONLY

–4–

REV. 0

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