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H11F1SVM Datasheet(PDF) 10 Page - Fairchild Semiconductor |
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H11F1SVM Datasheet(HTML) 10 Page - Fairchild Semiconductor |
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10 / 11 page  ©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 10 Reflow Profile Profile Freature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60–120 seconds Ramp-up Rate (tL to tP) 3°C/second max. Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60–150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. Time (seconds) Time 25°C to Peak 260 240 220 200 180 160 140 120 100 80 60 40 20 0 TL ts tL tP TP Tsmax Tsmin 120 Preheat Area Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S 240 360 |
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