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HGT4E30N60B3DS Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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HGT4E30N60B3DS Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 8 page ©2001 Fairchild Semiconductor Corporation HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 Absolute Maximum Ratings TC =25oC, Unless Otherwise Specified HGTG30N60B3D, HGT4E30N60B3DS UNITS Collector to Emitter Voltage .. .. .. .. .. .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. ..BVCES 600 V Collector Current Continuous At TC =25 oC . . . . . . ... .. .. .. .. .. .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. .. I C25 60 A At TC =110 oC . .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. . I C110 30 A Average Diode Forward Current at 110oC . .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. IEC(AVG) 25 A Collector Current Pulsed (Note 1) . .. .. .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. .. ICM 220 A Gate to Emitter Voltage Continuous.. .. .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... . . . . . VGES ±20 V Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . ... .. .. .. .. .. .. .. .. .. ... .. .. VGEM ±30 V Switching Safe Operating Area at TJ =150 oC (Figure 2) .. .. .. .. .. .. .. .. ... .. .. SSOA 60A at 600V Power Dissipation Total at TC =25 oC . . . . . . . . . . ... .. .. .. .. .. .. .. .. .. ... .. .. .. .P D 208 W Power Dissipation Derating TC >25 oC . .. .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. .. .. . 1.67 W/oC Operating and Storage Junction Temperature Range . .. .. .. .. .. .. .. .. .. ... ..TJ,TSTG -55to150 oC Maximum Lead Temperature for Soldering .. .. .. ... .. .. .. .. .. .. .. .. .. ... .. .. .. . TL 260 oC Short Circuit Withstand Time (Note 2) at VGE = 12V.. .. .. .. .. .. .. .. .. .. ... .. .. .. .tSC 4 µs Short Circuit Withstand Time (Note 2) at VGE = 10V.. .. .. .. .. .. .. .. .. .. ... .. .. .. .tSC 10 µs CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationof the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) =360V, TJ = 125 oC, R G =3Ω. Electrical Specifications TC =25 oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Collector to Emitter Breakdown Voltage BVCES IC =250µA, VGE =0V 600 - - V Collector to Emitter Leakage Current ICES VCE =BVCES TC =25 oC - - 250 µA TC =150 oC- - 3 mA Collector to Emitter Saturation Voltage VCE(SAT) IC =IC110, VGE =15V TC =25 oC - 1.45 1.9 V TC =150 oC- 1.7 2.1 V Gate to Emitter Threshold Voltage VGE(TH) IC =250µA, VCE =VGE 4.2 5 6 V Gate to Emitter Leakage Current IGES VGE = ±20V - - ±250 nA Switching SOA SSOA TJ =150 oC, R G =3Ω, VGE =15V, L =100µH VCE (PK) = 480V 200 - - A VCE (PK) =600V 60 - - A Gate to Emitter Plateau Voltage VGEP IC =IC110,VCE =0.5 BVCES -7.2 - V On-State Gate Charge QG(ON) IC =IC110, VCE =0.5 BVCES VGE = 15V - 170 190 nC VGE = 20V - 230 250 nC Current Turn-On Delay Time td(ON)I IGBT and Diode at TJ =25 oC, ICE =IC110, VCE =0.8 BVCES, VGE =15V, RG =3Ω, L=1mH , Test Circuit (Figure 19) -36 - ns Current Rise Time trI -25 - ns Current Turn-Off Delay Time td(OFF)I -137 - ns Current Fall Time tfI -58 - ns Turn-On Energy EON - 550 800 µJ Turn-Off Energy (Note 3) EOFF - 680 900 µJ HGTG30N60B3D, HGT4E30N60B3DS |
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