4

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Case Size

Preheat:

150°C ~ 180°C

Max. Soldering

Temperature

Max. Exposure Time at Max.

Soldering Temperature

Max. Exposure Time

Above +200°C

Multiple Reflow

Exposure

4x6.3

120 seconds max.

+250°C

5 seconds

70 seconds

2 times max.

5x6.3

120 seconds max.

+250°C

5 seconds

70 seconds

2 times max.

6.3x6.3

120 seconds max.

+250°C

5 seconds

70 seconds

2 times max.

6.3x8

120 seconds max.

+250°C

5 seconds

70 seconds

2 times max.

8x10.5

120 seconds max.

+245°C

5 seconds

60 seconds

2 times max.

10x8

120 seconds max.

+240°C

5 seconds

50 seconds

2 times max.

10x10.5

120 seconds max.

+240°C

5 seconds

50 seconds

2 times max.

12.5x14

120 seconds max.

+240°C

5 seconds

50 seconds

2 times max.

16x17

120 seconds max.

+230°C

5 seconds

30 seconds

2 times max.

PEAK REFLOW SOLDERING TEMPERATURES

AND DURATIONS (STANDARD VERSION)

Case Size

Preheat:

150°C ~ 180°C

Max. Soldering

Temperature

Max. Exposure Time at Max.

Soldering Temperature

Max. Exposure Time

Above +200°C

Max. Exposure Time

Above +230°C

Multiple Reflow

Exposure

4x6.3

120 seconds max.

+255°C

5 seconds

60 seconds

30 seconds

2 times max.

5x6.3

120 seconds max.

+255°C

5 seconds

60 seconds

30 seconds

2 times max.

6.3x6.3

120 seconds max.

+255°C

5 seconds

60 seconds

30 seconds

2 times max.

6.3x8

120 seconds max.

+255°C

5 seconds

60 seconds

30 seconds

2 times max.

8x10.5

120 seconds max.

+250°C

5 seconds

60 seconds

30 seconds

2 times max.

10x8

120 seconds max.

+250°C

5 seconds

60 seconds

30 seconds

2 times max.

10x10.5

120 seconds max.

+250°C

5 seconds

60 seconds

20 seconds

2 times max.

PEAK REFLOW SOLDERING TEMPERATURES

AND DURATIONS (M1 VERSION)

RECOMMENDED REFLOW SOLDERING PROFILE

Time Above 200°C

(see table)

50

100

150

200

Time (Seconds)

Preheat - 120 seconds max.

(see table for temperature)

Peak Temperature

(see table)

230

Time Above 230°C

(see table)

Review & Compare Reflow Soldering Heat Limits

V-chip SMT Aluminum Electrolytic Capacitors

www.niccomp.com/RSL

Case Size

a

b

c

4

φ

1.0

2.6

1.8

5

φ

1.4

3.0

1.8

6.3

φ

2.1

3.5

1.8

8

φ

2.8

4.1

2.1

10

φ

4.3

4.4

2.5

12.5

φ

4.3

5.8

2.5

16

φ

6.6

6.5

5.0

a

c

b

RECOMMENDED LAND PATTERN DIMENSIONS (mm)

PRECAUTIONS

Please review the notes on correct use, safety and precautions found on

pages T10 & T11 of NIC’s Electrolytic Capacitor catalog.

Also found at www.niccomp.com/precautions

If in doubt or uncertainty, please review your specific application - process

details with NIC’s technical support personnel: tpmg@niccomp.com