4

Solder Reflow Thermal Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5 C ± 0.5 C/SEC.

3 C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

Recommended Pb-Free IR Flow

217°C

RAMP-DOWN

6°C/SEC.MAX.

RAMP-UP

3 C/SEC.MAX.

150-200°C

260+0/-5°C

t25°CtoPEAK

60to150SEC.

20-40SEC.

TIMEWITHIN5°CofACTUAL

PEAKTEMPERATURE

tp

ts

PREHEAT

60to180SEC.

tL

TL

Tsmax

Tsmin

25

Tp

TIME

Notes:

The time from 25 °C to peak temperature = 8 minutes max.

Tsmax = 200 °C, Tsmin = 150 °C

Non-halide flux should be used

Regulatory Information

The ACPL-M75L has been approved by the following organizations:

Non-halide flux should be used.

UL

Recognized under UL 1577, component recognition

program, File E55361.

CSA

Approved under CSA Component Acceptance Notice #5,

File CA88324.

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01

(Option 060 only)