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ERB1885C2E4R0BDX1D Datasheet(PDF) 9 Page - Murata Manufacturing Co., Ltd. |
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ERB1885C2E4R0BDX1D Datasheet(HTML) 9 Page - Murata Manufacturing Co., Ltd. |
9 / 20 page Specifications and Test Methods ERB Series Item Specifications Test Method Operating Temperature 55°C to 125°C Reference Temperature: 25 Appearance No defects or abnormalities. Visual inspection. Dimension Within the specified dimensions. Using calipers. Dielectric Strength No defects or abnormalities. 300%* of the rated voltage *250V/300V: 250%, 500V: 200% Insulation Resistance 1,000,000M min.(C 470pF) 100,000 M min. (C 470pF) C: Nominal capacitance (pF) DC voltage not exceeding the rated voltage at 25°C and 75%RH max. and within 2 minutes of charging. Q C 220pF: Q 10,000 Frequency 1±0.1MHz 220pF C 470pF: Q 5,000 Voltage 1±0.2Vrms 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Adhesive Strength of Termination No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) then apply 10N force in parallel with the test jig for 10±1sec. Vibration Resistance Appearance: No defects or abnormalities. Capacitance: Within the specified tolerance. C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 minute. This motion should be applied for a period of 2 hours in each of 3 mutually perpendicular directions total of 6 hours). Deflection No crack or marked defect should occur. Flexure: 1mm Solderability of Termination 95% of the terminations are to be soldered evenly and continuously. Immerse in eutectic solder solution for 5±0.5 seconds at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds at 245±5°C. Resistance to Soldering Heat Appearance: No marking defects Capacitance Change: Within ±2.5% or ±0.25 pF (Whichever is larger) C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Immerse the capacitor in a eutectic solder solution or Sn-3.0Ag-0.5Cu solder solution at 270±5°C for 10±0.5 seconds. Let sit at room temperature for 24±2 hours. Temperature Cycle Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5 pF (Whichever is larger) C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) 55 to 125 Five cycles Humidity Steady State Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5pF (Whichever is larger) C 30pF: Q 350 10pF C<30pF: Q 275+ 5°C/2°C 10pF: Q 200+10C C: Nominal capacitance (pF) Apply the 24-hour heat (-10 to +65 ) and humidity (80 to 100%) treatment, 10 consecutive times. High Temperature Load Appearance: No marking defects Capacitance Change: Within ±3% or ±0.3pF (Whichever is larger) C 30pF: Q 350 10pF C<30pF: Q 275+5°C/2°C 10pF: Q 200+10°C C: Nominal capacitance (pF) Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Specifications and Test Methods ERB Series Item Specifications Test Method Operating Temperature 55°C to 125°C Reference Temperature: 25 Appearance No defects or abnormalities. Visual inspection. Dimension Within the specified dimensions. Using calipers. Dielectric Strength No defects or abnormalities. 300%* of the rated voltage *250V/300V: 250%, 500V: 200% Insulation Resistance 1,000,000M min.(C 470pF) 100,000 M min. (C 470pF) C: Nominal capacitance (pF) DC voltage not exceeding the rated voltage at 25°C and 75%RH max. and within 2 minutes of charging. Q C 220pF: Q 10,000 Frequency 1±0.1MHz 220pF C 470pF: Q 5,000 Voltage 1±0.2Vrms 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Adhesive Strength of Termination No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) then apply 10N force in parallel with the test jig for 10±1sec. Vibration Resistance Appearance: No defects or abnormalities. Capacitance: Within the specified tolerance. C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 minute. This motion should be applied for a period of 2 hours in each of 3 mutually perpendicular directions total of 6 hours). Deflection No crack or marked defect should occur. Flexure: 1mm Solderability of Termination 95% of the terminations are to be soldered evenly and continuously. Immerse in eutectic solder solution for 5±0.5 seconds at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds at 245±5°C. Resistance to Soldering Heat Appearance: No marking defects Capacitance Change: Within ±2.5% or ±0.25 pF (Whichever is larger) C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) Immerse the capacitor in a eutectic solder solution or Sn-3.0Ag-0.5Cu solder solution at 270±5°C for 10±0.5 seconds. Let sit at room temperature for 24±2 hours. Temperature Cycle Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5 pF (Whichever is larger) C 220pF: Q 10,000 220pF C 470pF: Q 5,000 470pF C 1000pF: Q 3,000 C: Nominal capacitance (pF) 55 to 125 Five cycles Humidity Steady State Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5pF (Whichever is larger) C 30pF: Q 350 10pF C<30pF: Q 275+ 5°C/2°C 10pF: Q 200+10C C: Nominal capacitance (pF) Apply the 24-hour heat (-10 to +65 ) and humidity (80 to 100%) treatment, 10 consecutive times. High Temperature Load Appearance: No marking defects Capacitance Change: Within ±3% or ±0.3pF (Whichever is larger) C 30pF: Q 350 10pF C<30pF: Q 275+5°C/2°C 10pF: Q 200+10°C C: Nominal capacitance (pF) Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Specifications and Test Methods The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as in Table A-1. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in steps 1, 3 and 5 by the cap. value in step 3. Capacitance Change: Within the specified tolerance. (Table A-1) Temperature Coefficent: Within the specified tolerance. (Table A-1) Capacitance Drift: Within ±0.2% or ±0.5pF (Whichever is larger) Capacitance Temperature Characteristics Step Temperature (°C) 1 25±2 2 -55±3 3 25±2 4 125±3 5 25±2 Applic Ation Sp E ci F ic cA pA cit o RS High Frequency Ceramic Capacitors ERB Specifications and Test Methods 52 – Innovator in Electronics C-29-C www .m urata.com |
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