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MIC5209-3.6BU Datasheet(PDF) 11 Page - Micrel Semiconductor |
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MIC5209-3.6BU Datasheet(HTML) 11 Page - Micrel Semiconductor |
11 / 13 page June 2006 11 M9999-060906 MIC5209 Micrel, Inc. Considering worst case tolerances, the power dissipation could be as high as: (VIN(max) – VOUT(max)) × IOUT + VIN(max) × IGND [(3.6V – 2.375V) × 320mA] + (3.6V × 4mA) PD = 407mW Using the maximum junction temperature of 125°C and a θJC of 8°C/W for the SOT-223, 25°C/W for the SO-8, or 2°C/W for the TO-263 package, the following worst-case heat-sink thermal resistance (θSA) requirements are: θJA J(max) A D TJ(max J(max TAA PDD = − θSA = θ SA SA JA = θ JA JA JC TA TT 40°C 50°C 60°C 75°C A A θJA (limit) 209°C/W 184°C/W 160°C/W 123°C/W θSA SOT-223 201°C/W 176°C/W 152°C/W 115°C/W SA SA θSA SO-8 184°C/W 159°C/W 135°C/W 98°C/W SA SA θSA TO-263-5 207°C/W 182°C/W 158°C/W 121°C/W SA SA Table 2. Maximum Allowable Thermal Resistance Table 2 and Figure 6 show that the Slot-1 power supply ap- plication can be implemented with a minimum footprint layout. T 40°C 50°C 60°C 75°C (limit) 209°C/W 184°C/W 160°C/W 123°C/W SOT-223 201°C/W 176°C/W 152°C/W 115°C/W SO-8 184°C/W 159°C/W 135°C/W 98°C/W TO-263-5 207°C/W 182°C/W 158°C/W 121°C/W Figure 6 shows the necessary copper pad area to obtain specific heat sink thermal resistance (θSA) values. The θSA values in Table 2 require much less than 500mm2 of copper, according to Figure 6, and can easily be accomplished with the minimum footprint. 0 10 20 30 40 50 60 70 0 2000 4000 6000 COPPER HEAT SINK AREA (mm2 COPPER HEAT SINK AREA (mm COPPER HEAT SINK AREA (mm ) Figure 6. PCB Heat Sink Thermal Resistance |
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