A165

1. Recommended Temperature Profile (SMT)

2. Recommended Manual Soldering Condition (SMT)

3. Recommended Screen Thickness (SMT)

4. Board Warp (SMT)

5. Cleaning Condition

6. Cautions

Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that

there is a return to normal temperature between the first and second cycle.

Note2: The temperature profile indicates the board surface temperature at the point of contacts

with the connector terminals.

Soldering iron temperature: 350±10ç, Soldering time: Within 3 seconds

0.15mm

Max 0.02mm in the connector center area, based on the both connector edges

Refer to the "Nylon Connector Use Hand book".

sThe receptacle is designed in a structure where contacts are exposed. Touching it with bare

hands would cause contact failure or electrostatic element damage.

sWhere no board is mounted, the insertion or extraction will cause damage or deformation in the contacts.

sAvoid retaining the board with the connector only, and fix the board by any other means than the connector.

sExcessive scoop insertion or extraction may result in damage.

sIn the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.

sThe color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

BPrecautions

50

60sec max

Soldering

100

150

200

250

Time (sec.)

Temperature (ç)

0

100

150

200

250

50

Room temperature

300

90~120sec

Preheating

180ç

250ç

220ç

150ç

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.