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1.Recommended Temperature Profile

(Compatible with lead-free soldering)

[Applicable Conditions]

1.Peak temperature: a maximum of 250°C for no more than 10 seconds

2.Heating unit: no less than 220°C for no more than 60 seconds

3.Preheating unit: 150 to 180°C for 90 to 120 seconds

4.Number of times: no more than 2 times

* Measurement is conducted at the contact lead part

As it may change depending on the conditions such as solder paste types,

manufacturers, PCB size, and other soldering materials, please fully check the

mounting conditions before use.

(Note 1) This temperature profile is a recommended value.

2.Recommended hand soldering

conditions

Temperature of soldering iron: 350±10°C, soldering time: 3 to 4 seconds

3.Recommended screen thickness and

aperture ratio (Pattern surface ratio)

Thickness: 0.1mm, aperture ratio: 100%

4.Warpage of the Board

A maximum of 0.02mm at the center of connector, as measured from either end of

the connector

5.Cleaning Conditions

IPA cleaning is allowed. (Cleaning is not recommended because cleaning may

change the push/pull feeling etc. Please contact us when you use other cleaning

agents. )

6.Precautions

▪ When inserting a crimp contact into a crimp socket, do not insert it at a slanted

angle in order to maintain the reliability of its performance.

▪ Please refrain from pushing/pulling operation when the PCB is not mounted. It

may cause breakage, contact deformation, etc.

▪ Please refrain from pushing/pulling operation with wires in your hand. It may

cause damage.

▪ During hand soldering, do not apply flux which will cause flux oozing on

connector.

▪ This product may have a little difference in its molded color depending on the

production lot, but the difference doesn't have any influence on the performance.

B

Precautions

TIME (sec)

180

℃

100

150

200

250

220

℃

PRE-HEATING TIME

SOLDERING TIME

MAX 250

℃

90~120sec

60secMAX

10secMAX

0