• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

195

!Caution/Notice

q Notice (Soldering and Mounting)

<Operating Environment>

Do not use products in a chemical atmosphere such as

chlorine gas, acid or sulfide gas.

Do not use products in the environment close to the

organic solvent.

<Storage and Handling Requirements>

1. Storage Period

BNX series should be used within 12 months.

Solderability should be checked if this period is

exceeded.

2. Storage Conditions

(1) Storage temperature: -10 to +40˚C

Relative humidity: 15 to 85%

Avoid sudden changes in temperature and humidity.

(2) Do not store products in a chemical atmosphere

such as chlorine gas, acid or sulfide gas.

1. Cleaning

Do not clean BNX series (SMD Type).

Before cleaning, please contact Murata engineering.

2. Soldering

Reliability decreases with improper soldering methods.

Please solder by the standard soldering conditions

shown in mounting information.

3. Other

Noise suppression levels resulting from Murata's EMI

suppression filters EMIFILr may vary, depending on

the circuits and ICs used, type of noise, mounting

pattern, mounting location, and other operating

conditions. Be sure to check and confirm in advance

the noise suppression effect of each filter, in actual

circuits, etc. before applying the filter in a commercial-

purpose equipment design.

q Rating

!Caution

q Handling

1. Resin Coating

Using resin for coating/molding products may affect

the products performance.

So please pay careful attention in selecting resin.

Prior to use, please make the reliability evaluation with

the product mounted in your application set.

Do not use products beyond the rated current and rated

voltage as this may create excessive heat and

deteriorate the insulation resistance.

q Storage and Operating Conditions

Notice

2. Handling of a Substrate (for BNX02p)

After mounting products on a substrate, do not apply

any stress to the product caused by bending or

twisting to the substrate when cropping the substrate,

inserting and removing a connector from the substrate

or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in

the Product.

Bending

Twisting