Electronic Components Datasheet Search |
|
CH80566EE014DT Datasheet(PDF) 9 Page - Intel Corporation |
|
CH80566EE014DT Datasheet(HTML) 9 Page - Intel Corporation |
9 / 73 page Introduction Datasheet 9 1.3 Terminology Term Definition # A “#” symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a non-maskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the “#” symbol implies that the signal is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]# = “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level). Front Side Bus (FSB) Refers to the interface between the processor and system core logic (also known as the Intel® SCH chipset components). AGTL+ Advanced Gunning Transceiver Logic is used to refer to Assisted GTL+ signaling technology on some Intel processors. Intel® Burst Performance Technology (Intel® BPT) Enables on-demand performance, without impacting or raising MID thermal design point. BFM Burst Frequency Mode CMOS Complementary Metal-Oxide Semiconductor Storage Conditions Refers to a non-operational state—the processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor landings should not be connected to any supply voltages, or have any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. Enhanced Intel SpeedStep® Technology Technology that provides power management capabilities to low power devices. Processor Core Processor core die with integrated L1 and L2 cache. All AC timing and signal integrity specifications are at the pads of the processor core. Intel Virtualization Technology Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform. TDP Thermal Design Power VCC The processor core power supply. VR Voltage Regulator VSS The processor ground VCCHFM VCC at Highest Frequency Mode (HFM) VCCLFM VCC at Lowest Frequency Mode (LFM) |
Similar Part No. - CH80566EE014DT |
|
Similar Description - CH80566EE014DT |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |