MAX5805 datasheet(2/31 Pages) MAXIM

Part #	MAX5805

Description	Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and I2C Interface

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Manufacturer	MAXIM [Maxim Integrated Products]

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MAX5803/MAX5804/MAX5805

Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output

Voltage DACs with Internal Reference and I2C Interface

2

Maxim Integrated

VDD to GND.............................................................-0.3V to +6V

VDDIO to GND .........................................................-0.3V to +6V

OUT, REF to GND ........-0.3V to lower of (VDD + 0.3V) and +6V

SCL, SDA, AUX, LDAC to GND ..............................-0.3V to +6V

ADDR to GND ...................................................-0.3V to lower of

(VDDIO + 0.3V) and +6V

Continuous Power Dissipation (TA = +70NC)

TDFN (derate 14.9mW/NC above +70NC)...............1188.7mW

µMAX (derate 8.8mW/NC above +70NC) ..................707.3mW

Maximum Continuous Current into Any Pin .................... ±50mA

Operating Temperature Range........................ -40NC to +125NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

TDFN

Junction-to-Ambient Thermal Resistance (

θJA) .......67.3NC/W

µMAX

Junction-to-Ambient Thermal Resistance (

θJA) .....113.1NC/W

Junction-to-Ambient Thermal Resistance (

θJC)...........42NC/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACkAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI , TA = -40NC to +125NC, unless otherwise noted.)

(Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC PERFORMANCE (Note 3)

Resolution and Monotonicity

N

MAX5803

8

Bits

MAX5804

10

MAX5805

12

Integral Nonlinearity (Note 4)

INL

MAX5803, 8 bits

-0.25

±0.05

+0.25

LSB

MAX5804, 10 bits

-0.5

±0.2

+0.5

MAX5805, 12 bits

-1

±0. 5

+1

Differential Nonlinearity (Note 4)

DNL

MAX5803, 8 bits

-0.25

±0.05

+0.25

LSB

MAX5804, 10 bits

-0.5

±0.1

+0.5

MAX5805, 12 bits

-1

±0.2

+1

Offset Error (Note 5)

OE

-5

±0.5

+5

mV

Offset Error Drift

±10

F

V/NC

Gain Error (Note 5)

GE

-1.0

±0.1

+1.0

%FS

Gain Temperature Coefficient

With respect to VREF

±2.5

ppm of

FS/NC

Zero-Scale Error

0

+10

mV

Full-Scale Error

With respect to VREF

-0.5

+0.5

%FS

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