Chip Resistor Surface Mount

www.yageo.com

Jan 05, 2011 V.6

Product specification

4

9

SERIES

RC

0402

CONSTRUCTION

The resistor is constructed on top

of a high-grade ceramic body.

Internal metal electrodes are added

on each end to make the contacts to

the thick film resistive element. The

composition of the resistive element

is a noble metal imbedded into a

glass and covered by a second glass

to prevent environment influences.

The resistor is laser trimmed to the

rated resistance value. The resistor

is covered with a protective epoxy

coat, finally the two external

terminations (matte tin on Ni-

barrier) are added. See fig.2

MARKING

RC0402

No marking

For further marking information, please see special data sheet “Chip resistors marking”

Fig. 1

ynsc007

DIMENSIONS

TYPE

RC0402

L (mm)

1.00 ±0.05

W (mm)

0.50 ±0.05

H (mm)

0.35 ±0.05

0.20 ±0.10

0.25 ±0.10

Table 1

overcoat

Primary glass layer

resistive layer

(Jumper chip is a conductor)

inner electrode

termination(Ni/matte tin)

ceramic substrate

H

I2

YNSC056

overcoat

W

L

O

S

For dimension see Table 1

Fig. 2 Chip resistor outlines