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LQH3NPN100NM0p Datasheet(PDF) 2 Page - Murata Manufacturing Co., Ltd.

Part # LQH3NPN100NM0p
Description  Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type) LQH3NP_M0 Series (1212 Size)
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Manufacturer  MURATA [Murata Manufacturing Co., Ltd.]
Direct Link  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

LQH3NPN100NM0p Datasheet(HTML) 2 Page - Murata Manufacturing Co., Ltd.

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Data Sheet
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
2
o This data sheet is applied for CHIP INDUCTORS (CHIP COILS) used for General Electronics equipment for your design.
2011.5.12
0.1
1
10
100
1000
0.1
1
10
100
1000
Frequency (MHz)
1.0
µH
10
µH
47
µH
100
µH
4.7
µH
0.1
1
10
100
1000
10
100
1000
10000
Current (mA)
1.0
µH
47
µH
10
µH
4.7
µH
100
µH
Current (mA)
50
40
30
20
10
0
0
500
1000
1500
2000
2500
100
µH47µH4.7µH1.0µH
10
µH
Inductors (Coils) > Chip Inductor (Chip Coil) > Power Inductor (Wire Wound Type)
<Rated Current>
(Based on Inductance Change)
When Rated Current is applied to the Products,
Inductance will be within +-30% of nominal
Inductance value.
<Rated Current>
(Based on Temperature Rise)
When Rated Current is applied to the Products,
self-generation of heat will rise to 40
°C or less.
I Notice (Rated Current)
I Inductance-Frequency Characteristics (Typ.)
I Inductance-Current Characteristics (Typ.)
I Temperature Rise Characteristics (Typ.)
!Caution (Rating)
Do not use products beyond the rated current as
this may create excessive heat.
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
I !Caution/Notice


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