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LMZ10501 Datasheet(PDF) 3 Page - Texas Instruments

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Part # LMZ10501
Description  Intergrated Inductor, Miniature Form Factor(3.0mm x 2.5mm x 1.425mm), 8-pin LLP Footprint
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LMZ10501 Datasheet(HTML) 3 Page - Texas Instruments

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LMZ10501
www.ti.com
SNVS677D – MAY 2011 – REVISED MARCH 2013
Absolute Maximum Ratings
(1) (2)
VIN, VREF to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
EN, FB, VCON
(SGND
−0.2V)
to (VIN +0.2V)
w/6.0V max
VOUT
(PGND
−0.2V)
to (VIN +0.2V)
w/6.0V max
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
+260°C
ESD Susceptibility(3)
±2kV
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
The human body model is a 100pF capacitor discharged through a 1.5 k
Ω resistor into each pin. Test method is per JESD-22-114.
Operating Ratings
(1)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
0 mA to 1000 mA
Junction Temperature (TJ) Range
−40°C to +125°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Thermal Properties
Junction-to-Ambient Thermal
120°C/W
Resistance (
θJA), NQB0008A Package
(1)
(1)
Junction-to-ambient thermal resistance (
θJA) is based on 4 layer board thermal measurements, performed under the conditions and
guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11.
θJA varies with PCB copper area, power dissipation, and airflow.
Electrical Characteristics
(1)
Specifications with standard typeface are for TJ = 25°C only; Limits in bold face type apply over the operating junction
temperature range TJ of -40°C to 125°C. Minimum and maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only. Unless otherwise stated the following conditions apply: VIN = 3.6V, VEN = 1.2V.
Min
Typ
Max
Symbol
Parameter
Conditions
Units
(1)
(2)
(1)
SYSTEM PARAMETERS
VREF x GAIN
Reference voltage x VCON to
VIN = VEN = 5.5V, VCON = 1.44V
5.7575
5.875
5.9925
V
FB Gain
GAIN
VCON to FB Gain
VIN = 5.5V, VCON = 1.44V
2.4375
2.5
2.5750
V/V
VINUVLO
VIN rising threshold
2.4
V
VINUVLO
VIN falling theshold
2.25
V
ISHDN
Shutdown supply current
VIN = 3.6V, VEN = 0.5V
11
18
µA
(3)
Iq
DC bias current into VIN
VIN = 5.5V, VCON = 1.6V, IOUT =
6.5
8.5
mA
0A
RDROPOUT
VIN to VOUTresistance
IOUT = 200 mA
285
425
m
Ω
(1)
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate the Average Outgoing Quality Level (AOQL).
(2)
Typical numbers are at 25°C and represent the most likely parametric norm.
(3)
Shutdown current includes leakage current of the high side PFET.
Copyright © 2011–2013, Texas Instruments Incorporated
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