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ACST1210-7G Datasheet(PDF) 5 Page - STMicroelectronics |
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ACST1210-7G Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 13 page ACST12 Characteristics Doc ID 15238 Rev 4 5/13 Figure 12. Relative variation of critical rate of decrease of main current versus junction temperature Figure 13. Relative variation of static dV/dt immunity versus junction temperature (dI/dt)c[Tj] / (dI/dt)c[Tj=125°C] Tj(°C) 0 1 2 3 4 5 6 7 8 9 10 11 25 50 75 100 125 dV/dt[Tj] / dV/dt[Tj=125°C] Tj(°C) 0 1 2 3 4 5 6 7 8 9 10 11 12 25 50 75 100 125 VD=VR=469 V Figure 14. Relative variation of maximum clamping voltage, VCL versus junction temperature Figure 15. Variation of thermal resistance junction to ambient versus copper surface under tab 0.85 0.90 0.95 1.00 1.05 1.10 1.15 -50 -25 0 25 50 75 100 125 V [T /V [T = 25 °C] CL J CL J T (°C) J Minimum values 0 10 20 30 40 50 60 70 80 0 5 10 15 20 R (°C/W) th(j-a) S (cm²) CU D²PAK Epoxy printed circuit board FR4, copper thickness = 35 µm |
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