VSP8133

SBES020A – JUNE 2011 – REVISED MAY 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

VSP8133

QFN-64

RSK

0°C to +85°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

RELATED DOCUMENTS

PRODUCT

LITERATURE NUMBER

VSP8133 User Reference Manual

SLEU107

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

VALUE

UNIT

AVDD30, IOVDD30, HVDD30,

–0.3 to +4.0

V

RGVDD30

Supply voltage

VL

GND to –10

V

VH

VL + 26

V

AVSS, IOVSS30, HVSS30, HLVSS,

Ground voltage differences

±0.1

V

RGVSS30

Digital input voltage

–0.3 to (IOVDD30 + 0.3)

V

Analog input voltage

–0.3 to (AVDD30 + 0.3)

V

Input current (all pins except supplies)

±10

mA

Ambient temperature under bias

–25 to +85

°C

Storage temperature

–55 to +125

°C

Junction temperature

+150

°C

Package temperature (IR reflow, peak)

+250

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2

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