CMF02

2008-05-13

2

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

Peak forward voltage

⎯

⎯

2.0

V

Repetitive peak reverse current

⎯

⎯

50

μA

Reverse recovery time

⎯

⎯

100

ns

Forward recovery time

⎯

270

⎯

ns

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

(soldering land: 2 mm

× 2 mm)

(board thickness: 0.64 mm)

⎯

⎯

60

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 6 mm

× 6 mm)

(board thickness: 1.6 mm)

⎯

⎯

135

Thermal resistance

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 2.1 mm

× 1.4 mm)

(board thickness: 1.6 mm)

⎯

⎯

210

°C/W

Thermal resistance (junction to lead)

⎯

⎯

⎯

16

°C/W

Marking

Standard Soldering Pad

Abbreviation Code

Part No.

F2

CMF02

Handling Precautions

The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a

moment. Do not exceed any of these ratings.

The following are the general derating methods we recommend for designing a circuit using this device.

at low temperature.

Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using

This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,

this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.

We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.

Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using

a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.

Refer to the Rectifier databook for further information.

3.0

1.4

Unit: mm

1.4