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CMF02TE12L.Q Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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CMF02TE12L.Q Datasheet(HTML) 2 Page - Toshiba Semiconductor |
2 / 4 page CMF02 2008-05-13 2 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Peak forward voltage VFM IFM = 1.0 A (pulse test) ⎯ ⎯ 2.0 V Repetitive peak reverse current IRRM VRRM = 600 V (pulse test) ⎯ ⎯ 50 μA Reverse recovery time trr IF = 1 A, di/dt =-30 A/μs ⎯ ⎯ 100 ns Forward recovery time tfr IF = 1 A ⎯ 270 ⎯ ns Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 mm) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 mm) ⎯ ⎯ 135 Thermal resistance Rth(j-a) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 mm) ⎯ ⎯ 210 °C/W Thermal resistance (junction to lead) Rth(j-ℓ) ⎯ ⎯ ⎯ 16 °C/W Marking Standard Soldering Pad Abbreviation Code Part No. F2 CMF02 Handling Precautions The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. The following are the general derating methods we recommend for designing a circuit using this device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an allowable Ta max- IF(AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. 3.0 1.4 Unit: mm 1.4 |
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