200

9-08-18

Page 2

Rev. 2.

1

BSP324

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - soldering point

(Pin 4)

-

16

25

K/W

SMD version, device on PCB:

@ min. footprint

-

-

85

45

115

70

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

400

-

-

V

1.3

1.9

2.3

Zero gate voltage drain current

-

-

0.01

-

0.1

10

µA

Gate-source leakage current

-

10

100

nA

Drain-source on-state resistance

-

14.3

22

Ω

Drain-source on-state resistance

-

13.6

25

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.