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CIG10W4R7MNC Datasheet(PDF) 2 Page - Samsung semiconductor |
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CIG10W4R7MNC Datasheet(HTML) 2 Page - Samsung semiconductor |
2 / 2 page Ver. 201207 CI G 10 W 2R2 M N C (1) (2) (3) (4) (5) (6) (7) (8) (1) Chip Inductor (2) Power Inductor (3) Dimension (4) Product Series (W:Normal Type) (5) Inductance (R47:0.47uH, 2R2:2.2uH) (6) Tolerance (M:±20%) (7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (8) Packaging(C:paper tape, E:embossed tape) ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications. PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 4,000 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PRODUCT IDENTIFICATION |
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