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FQB6N80 Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FQB6N80 Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 9 page ©2000 Fairchild Semiconductor International September 2000 Rev. A, September 2000 QFETTM FQB6N80 / FQI6N80 800V N-Channel MOSFET General Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply. Features • 5.8A, 800V, RDS(on) = 1.95Ω @VGS = 10 V • Low gate charge ( typical 31 nC) • Low Crss ( typical 14 pF) • Fast switching • 100% avalanche tested • Improved dv/dt capability Absolute Maximum Ratings T C = 25°C unless otherwise noted Thermal Characteristics Symbol Parameter FQB6N80 / FQI6N80 Units VDSS Drain-Source Voltage 800 V ID Drain Current - Continuous (TC = 25°C) 5.8 A - Continuous (TC = 100°C) 3.67 A IDM Drain Current - Pulsed (Note 1) 23.2 A VGSS Gate-Source Voltage ± 30 V EAS Single Pulsed Avalanche Energy (Note 2) 680 mJ IAR Avalanche Current (Note 1) 5.8 A EAR Repetitive Avalanche Energy (Note 1) 15.8 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.0 V/ns PD Power Dissipation (TA = 25°C) * 3.13 W Power Dissipation (TC = 25°C) 158 W - Derate above 25°C 1.27 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds 300 °C Symbol Parameter Typ Max Units RθJC Thermal Resistance, Junction-to-Case -- 0.79 °C/W RθJA Thermal Resistance, Junction-to-Ambient * -- 40 °C/W RθJA Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W * When mounted on the minimum pad size recommended (PCB Mount) 3 5 ! ! ! " " " 3 5 ! ! ! " " " S D G D2-PAK FQB Series I2-PAK FQI Series G S D G S D |
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