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MAX8893BEWV+ Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX8893BEWV+ Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 51 page 2 Maxim Integrated µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP MAX8893A/MAX8893B/MAX8893C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. IN1, IN2, BATT, COM1, COM2 to AGND.............-0.3V to +6.0V BUCK, LS, ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, REFBP, LDO2, LDO3, SCL, SDA, ENUSB, CB, NC1, NC2, NO1, NO2 to AGND .......................... -0.3V to (VBATT + 0.3V) LDO1, LDO4, LDO5 to AGND.................. -0.3V to (VIN2 + 0.3V) PGND to AGND....................................................-0.3V to +0.3V LX Current .....................................................................1.5ARMS LX to AGND (Note 1)................................ -0.3V to (VIN1 + 0.3V) Continuous Power Dissipation (TA = +70NC) 30-Bump, 3.0mm x 2.5mm WLP (derate 20.0mW/NC above +70NC).............................................................1600mW Junction-to-Ambient Thermal Resistance (θJA) (Note 2) ........................................................................50NC/W Operating Temperature Range.......................... -40NC to +85NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Bump Temperature (soldering) Infrared (15s)...............................................................+200NC Vapor Phase (20s).......................................................+215NC ELECTRICAL CHARACTERISTICS (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) ABSOLUTE MAXIMUM RATINGS Note 1: LX has internal clap diodes to PGND and IN1. Applications that forward bias these diodes should take care not to exceed the IC’s package-dissipation limits. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay- er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. PARAMETER CONDITIONS MIN TYP MAX UNIT Input Supply Range 2.7 5.5 V Shutdown Supply Current VCB = 0V or VIN, VENUSB = VIN, VENLS = VENBUCK = VENLDO1 = VENLDO2 = VENLDO3 = VENLDO45 = 0V 0.6 5 F A No-Load Supply Current No load on BUCK, LDO1, LDO2, LDO3, LDO4, and LDO5, VENUSB = 0V, VENLS = VIN 160 200 F A Light-Load Supply Current BUCK on with 500FA load, all LDOs on with no load, VENUSB = 0V, VENLS = VIN 315 F A UNDERVOLTAGE LOCKOUT Undervoltage Lockout (Note 5) VIN_ rising 2.70 2.85 3.05 V VIN_ falling 2.35 2.55 THERMAL SHUTDOWN Thermal Shutdown Threshold TA rising 160 N C Thermal Shutdown Hysteresis 10 N C REFERENCE Reference Bypass Output Voltage 0.786 0.800 0.814 V REF Supply Rejection 2.7V P VIN P 5.5V 0.2 mV/V LOGIC AND CONTROL INPUTS Input Low Level ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V 0.4 V Input High Level ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V 1.4 V |
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