Practical considerations

TDA2030

10/17

Doc ID 1458 Rev 3

4

Practical considerations

4.1

Printed circuit board

The layout shown in Figure 19 should be adopted by the designers. If different layouts are

used, the ground points of input 1 and input 2 must be well decoupled from the ground

return of the output in which a high current flows.

4.2

Assembly suggestion

No electrical isolation is needed between the package and the heatsink with single supply

voltage configuration.

4.3

Application suggestions

The recommended values of the components are those shown on application circuit of

Figure 16. However, if different values are chosen, then the following table can be helpful.

Table 5.

Variations from recommended values

Component

Recommanded

value

Purpose

Larger than

recommanded value

Smaller than

recommanded value

22 k

Ω

Closed loop gain setting

Increase of gain

680

Ω

Closed loop gain setting

Decrease of gain(1)

Increase in gain

22 k

Ω

Non-inverting input biasing

Increase of input

impedance

Decrease in input

impedance

1

Ω

Frequency stability

Danger of oscillation at

high frequencies with

inductive loads

Upper frequency cutoff

Poor high-frequency

attenuation

Danger of oscillation

1 µF

Input DC decoupling

Increase in low-

frequency cutoff

22 µF

Inverting input DC

decoupling

Increase in low-

frequency cutoff

0.1 µF

Supply voltage bypass

Danger of oscillation

100 µF

Supply voltage bypass

Danger of oscillation

0.22 µF

Frequency stability

Danger of oscillation

Upper frequency cutoff

Smaller bandwidth

Larger bandwidth

1N4001

To protect the device against output voltage spikes

1.

Closed loop gain must be higher than 24 dB

1

2

πBR

1

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