PTN04050C

SLTS251A

– SEPTEMBER 2005 – REVISED FEBRUARY 2011

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range unless otherwise noted

all voltages with respect to GND (pin 1),

UNIT

Operating free-air temperature

–40°C to 85°C

Leaded temperature (H suffix)

5 seconds

260

Solder reflow temperature (S suffix)

Surface temperature of module body or pins

235

°C

Surface temperature of module body or pins

260

Storage temperature

–55°C to 125°C

Output power

12 W

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

This model is NOT compatible with surface-mount reflow solder process.

(3)

Moisture Sensitivity Level (MSL) Rating Level-3-260C-168HR

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Input voltage

2.95

5.5

V

Operating free-air temperature

–40

85

°C

PACKAGE SPECIFICATIONS

PTN04050Cx (Suffix AH, AS, and AZ)

Weight

2.8 grams

Flammability

Meets UL 94 V-O

Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 sine,

Mechanical shock

mounted

Horizontal T/H (suffix AH)

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000 Hz

Horizontal SMD (suffix AS and AZ)

(1)

Qualification limit.

2

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