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PCM1720E Datasheet(PDF) 3 Page - Texas Instruments |
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PCM1720E Datasheet(HTML) 3 Page - Texas Instruments |
3 / 17 page ® PCM1720 3 PIN ASSIGNMENTS PIN NAME TYPE FUNCTION 1 NC — No Connection. 2 SCKI IN System Clock Input: 256fS or 384fS. 3 TEST OUT Reserved for Factory Use. 4* ML IN Latch Enable for Serial Control Data. 5* MC IN Clock for Serial Control Data. 6* MD IN Data Input for Serial Control. 7* RSTB IN Reset Input. When this pin is low, the digital filters and modulators are held in reset. 8 ZERO OUT Zero Data Flag. This pin is low when the data is continuously zero for more than 65,535 cycles of BCKIN. 9VOUTR OUT Right Channel Analog Output. 10 AGND PWR Analog Ground. 11 VCC PWR Analog Power Supply (+5V). 12 VOUTL OUT Left Channel Analog Output. 13 CAP — Common Pin for Analog Output Amplifiers. 14* BCKIN IN Bit Clock for Clocking in the Audio Data. 15* DIN IN Serial Audio Data Input. 16* LRCIN IN Left/Right Word Clock. Frequency is equal to fs. 17 GND PWR Ground. 18 NC — No Connection. 19 VDD PWR Digital Power Supply (+5V). Recommended con- nection is to the analog power supply. 20 DGND PWR Digital Ground. Recommended connection is to the digital ground plane. * These pins include internal pull-up resistors. PIN CONFIGURATION TOP VIEW SSOP PACKAGE INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) PCM1720 20-Pin SSOP 334-1 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ABSOLUTE MAXIMUM RATINGS Power Supply Voltage ....................................................................... +6.5V +VCC to +VDD Difference ................................................................... ±0.1V Input Logic Voltage .................................................. –0.3V to (VDD + 0.3V) Power Dissipation .......................................................................... 300mW Operating Temperature Range ......................................... –25 °C to +85°C Storage Temperature ...................................................... –55 °C to +125°C Lead Temperature (soldering, 5s) .................................................. +260 °C Thermal Resistance, θ JA .............................................................. +70°C/W NC SCKI TEST ML MC MD RSTB ZERO V OUTR AGND DGND V DD NC GND LRCIN DIN BCKIN CAP V OUTL V CC 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Not Recommended For New Designs |
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