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MSP430F2234IYFFR Datasheet(PDF) 2 Page - Texas Instruments |
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MSP430F2234IYFFR Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 95 page  MSP430F22x2 MSP430F22x4 SLAS504G – JULY 2006 – REVISED AUGUST 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs. The MSP430F22x4/MSP430F22x2 series is an ultra-low-power mixed signal microcontroller with two built-in 16- bit timers, a universal serial communication interface, 10-bit A/D converter with integrated reference and data transfer controller (DTC), two general-purpose operational amplifiers in the MSP430F22x4 devices, and 32 I/O pins. Typical applications include sensor systems that capture analog signals, convert them to digital values, and then process the data for display or for transmission to a host system. Stand-alone radio-frequency (RF) sensor front ends are another area of application. Table 1. Available Options PACKAGED DEVICES(1)(2) TA PLASTIC 49-PIN BGA PLASTIC 38-PIN TSSOP PLASTIC 40-PIN QFN (YFF) (DA) (RHA) MSP430F2232IYFF MSP430F2232IDA MSP430F2232IRHA MSP430F2252IYFF MSP430F2252IDA MSP430F2252IRHA MSP430F2272IYFF MSP430F2272IDA MSP430F2272IRHA -40°C to 85°C MSP430F2234IYFF MSP430F2234IDA MSP430F2234IRHA MSP430F2254IYFF MSP430F2254IDA MSP430F2254IRHA MSP430F2274IYFF MSP430F2274IDA MSP430F2274IRHA MSP430F2232TDA MSP430F2232TRHA MSP430F2252TDA MSP430F2252TRHA MSP430F2272TDA MSP430F2272TRHA -40°C to 105°C MSP430F2234TDA MSP430F2234TRHA MSP430F2254TDA MSP430F2254TRHA MSP430F2274TDA MSP430F2274TRHA (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Development Tool Support All MSP430™ microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging and programming through easy-to-use development tools. Recommended hardware options include: • Debugging and Programming Interface – MSP-FET430UIF (USB) – MSP-FET430PIF (Parallel Port) • Debugging and Programming Interface with Target Board – MSP-FET430U38 (DA package) • Production Programmer – MSP-GANG430 2 Copyright © 2006–2012, Texas Instruments Incorporated |
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