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LM2941T Datasheet(PDF) 2 Page - Texas Instruments |
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LM2941T Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) LM2941T, LM2941S, LM2941LD 60V Input Voltage (Survival Voltage, ≤ 100ms) LM2941CT, LM2941CS 45V Internal Power Dissipation (3) Internally Limited Maximum Junction Temperature 150°C Storage Temperature Range −65°C ≤ TJ ≤ +150°C TO-220 (T), Wave 260°C, 10s Soldering Temperature(4) TO-263 (S) 235°C, 30s WSON-8 (LD) 235°C, 30s ESD Rating (5) ±2 kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. (4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. (5) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k Ω resistor into each pin. Test method is per JESD22–A114. Operating Ratings Maximum Input Voltage 26V LM2941T −40°C ≤ TJ ≤ 125°C LM2941CT 0°C ≤ TJ ≤ 125°C Temperature Range LM2941S −40°C ≤ TJ ≤ 125°C LM2941CS 0°C ≤ TJ ≤ 125°C LM2941LD −40°C ≤ TJ ≤ 125°C Electrical Characteristics—LM2941T, LM2941S, LM2941LD 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. LM2941T LM2941S Units Parameter Conditions Typ LM2941LD (Limits) Limit 1.237/1.211 V(min) Reference Voltage 5mA ≤ IO ≤ 1A (1) 1.275 1.313/1.339 V(max) Line Regulation VO + 2V ≤ VIN ≤ 26V, IO = 5mA 4 10/10 mV/V(max) Load Regulation 50mA ≤ IO ≤ 1A 7 10/10 mV/V(max) 100 mADC and 20 mArms Output Impedance 7 m Ω/V fO = 120Hz VO + 2V ≤ VIN < 26V, IO = 5mA 10 15/20 mA(max) Quiescent Current VIN = VO + 5V, IO = 1A 30 45/60 mA(max) (1) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C |
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